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Substance:Copper

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  • Main ChemSpider page
  • Molecular formula: Cu
  • Molar mass: 63.546
  • CAS Registry Number: Not available
  • Appearance: Copper powder, 5% in graphite; Copper, AAS standard solution, Specpure®, Cu 1000µg/ml; Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, 99.995+% (metals basis), Oxygen free; Copper shot, 0.8-2mm (0.03-0.08in), 99.5% (metals basis); Copper shot, 0.6-0.8mm (0.02-0.03in), 99.5% (metals basis); Copper turnings, 99.9% (metals basis); Copper rod, 2.0mm (0.08in) dia, 99.99% (metals basis); Copper plate, irregular, nominal 10x34x0.6cm (4x13.5x0.25in), Puratronic®, 99.999% (metals basis); Copper powder, spherical, -170+400 mesh, 99.9% (metals basis), Oxygen <1000ppm; Copper wire, 0.015mm (0.0006in) dia, 99.99% (metals basis); Copper sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis); Copper sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis); Copper wire, 1.0mm (0.04in) dia, Puratronic®, 99.9999% (metals basis); Copper wire, 0.5mm (0.02in) dia, Puratronic®, 99.9999% (metals basis); Copper wire, 0.25mm (0.01in) dia, Puratronic®, 99.9999% (metals basis); Copper wire, 0.1mm (0.004in) dia, Puratronic®, 99.9999% (metals basis); Copper foil, 1.0mm (0.04in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.5mm (0.02in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.25mm (0.01in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.1mm (0.004in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.05mm (0.002in) thick, Puratronic®, 99.9999% (metals basis); Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, Puratronic®, 99.9999% (metals basis); Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, Puratronic®, 99.9999% (metals basis); Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, Puratronic®, 99.9999% (metals basis); Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, Puratronic®, 99.9999% (metals basis); Copper gauze, 20 mesh woven from 0.41mm (0.016in) dia wire; Copper powder, spherical, APS 10 micron, 99.9% (metals basis); Copper powder, spherical, -100+325 mesh, 99.9% (metals basis); Copper powder, -625 mesh, APS 3.25-4.75 micron, 99.9% (metals basis); Copper, Oil based standard solution, Specpure®, Cu 5000µg/g; Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, 99.995% (metals basis); Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, 99.996% (metals basis); Copper foil, 0.1mm (0.004in) thick, Puratronic®, 99.999% (metals basis); Copper Thinfoil, 0.015mm (0.0006in) thick, 99.97% (metals basis); Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis); Copper flake, 1-5 micron, 99.9% (metals basis); Copper gauze, 40 mesh woven from 0.056mm (0.0022in) dia wire; Copper sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis); Copper sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.999% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.999% (metals basis); Copper foil, 0.675mm (0.027in) thick, annealed, 99.9% (metals basis); Copper gauze, 50 mesh woven from 0.23mm (0.009in) dia wire; Copper powder, -100 mesh, 99.999% (metals basis); Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.996% (metals basis); Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.99% (metals basis); Copper Thinfoil, 0.0125mm (0.0005in) thick, 99.9% (metals basis); Copper shot, 13mm (0.5in) dia, 99.99% (metals basis), oxygen free; Copper shot, 8mm (0.3in) & down, ACS, 99.9+% (metals basis); Copper wire, 1.0mm (0.04in) dia, Puratronic®, 99.999% (metals basis), Oxygen free; Copper wire, 0.5mm (0.02in) dia, Puratronic®, 99.999% (metals basis), Oxygen free; Copper foil, 0.25mm (0.01in) thick, annealed, 99.95% (metals basis), oxygen free; Copper foil, 0.5mm (0.02in) thick, Puratronic®, 99.998% (metals basis), Oxygen free; Copper foil, 0.05mm (0.002in) thick, annealed, 99.8% (metals basis); Copper Thinfoil, 0.01mm (0.0003in) thick, 99.8% (metals basis); Copper, Quant® Test Strips; Copper powder, -40+100 mesh, 99.5% (metals basis); Copper rod, 3.18mm (0.125in) dia, random lengths, Puratronic®, 99.999% (metals basis); Copper powder, -625 mesh, APS 2-3.50 micron, 99% (metals basis); Copper powder, -100 mesh, 99% (metals basis); Copper wire, 0.127mm (0.005in) dia, 99.999% (metals basis); Copper wire, 0.64mm (0.025in) dia, Puratronic®, 99.999% (metals basis), Oxygen free; Copper foil, 0.25mm (0.01in) thick, hard, Puratronic®, 99.999+% (metals basis); Copper foil, 0.127mm (0.005in) thick, annealed, 99.99+% (metals basis); Copper, plasma standard solution, Specpure®, Cu 10,000µg/ml; Copper, Oil based standard solution, Specpure®, Cu 1000µg/g; Copper rod, 6.35mm (0.25in) dia, 99.9% (metals basis); Copper powder, -325 mesh, 10% max +325 mesh, 99% (metals basis); Copper, plasma standard solution, Specpure®, Cu 1000µg/ml; Copper tubing, 1.59mm (0.0626in) OD, 0.876mm (0.0345in) ID, 99.9% (metals basis); Copper tubing, 3.175mm (0.125in) OD, 1.5mm (0.059in) ID, 99.9% (metals basis); Copper foil, 0.025mm (0.001in) thick, 99.8% (metals basis); Copper foil, 0.127mm (0.005in) thick, annealed, 99.9% (metals basis); Copper foil, 0.254mm (0.010in) thick, 99.9% (metals basis); Copper foil, 1.27mm (0.05in) thick, 99.9% (metals basis); Copper plate, 6.35mm (0.25in) thick, 99.9% (metals basis); Copper rod, 19mm (0.8in) dia, Puratronic®, 99.999% (metals basis); Copper rod, 5mm (0.2in) dia, Puratronic®, 99.999% (metals basis); Copper rod, 7mm (0.3in) dia, Puratronic®, 99.999% (metals basis); Copper foil, 0.25mm (0.01in) thick, Puratronic®, 99.9985% (metals basis); Copper foil, 0.5mm (0.02in) thick, Puratronic®, 99.9985% (metals basis); Copper foil, 1.0mm (0.04in) thick, Puratronic®, 99.999% (metals basis); Copper foil, 2.0mm (0.08in) thick, Puratronic®, 99.999% (metals basis); Copper powder, spherical, -100 mesh, 99.5% (metals basis); Copper wire, 2.0mm (0.08in) dia, Puratronic®, 99.999% (metals basis); Copper wire, 1.0mm (0.04in) dia, Puratronic®, 99.999% (metals basis); Copper wire, 0.5mm (0.02in) dia, Puratronic®, 99.999% (metals basis); Copper wire, 0.25mm (0.01in) dia, Puratronic®, 99.9985% (metals basis); Copper wire, 0.1mm (0.004in) dia, hard, Puratronic®, 99.9985% (metals basis); Copper wire, 0.025mm (0.001in) dia, Puratronic®, 99.995% (metals basis); Copper shot, 9mm (0.35in) & down, Puratronic®, 99.9999% (metals basis); Copper foil, 1.0mm (0.04in) thick, 99.99% (metals basis); Copper shot, 4-6mm (0.16-0.24in), Puratronic®, 99.999% (metals basis); Copper discs, 9.0+/-0.127mm (0.354+/-0.005in) dia x 0.8+/-0.051mm (0.03+/-0.002in) thick, 99.9995% (metals basis); Copper foil, 0.025mm (0.001in) thick, Puratronic®, 99.999% (metals basis); Copper wire, 0.5mm (0.02in) dia, annealed, 99.9% (metals basis); Copper wire, 1.0mm (0.04in) dia, annealed, 99.9% (metals basis); Copper powder, -22 mesh, Puratronic®, 99.999% (metals basis); Copper turnings, 99+% (metals basis); Copper powder, -150 mesh, 99.5% (metals basis); Copper shot, 1-10mm (0.04-0.4in), 99.9% (metals basis); Copper rod, 9.5mm (0.4in) dia, Puratronic®, 99.999% (metals basis); Copper powder, 5% in graphite; Copper, AAS standard solution, Specpure®, Cu 1000µg/ml; Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, 99.995+% (metals basis), Oxygen free; Copper shot, 0.8-2mm (0.03-0.08in), 99.5% (metals basis); Copper shot, 0.6-0.8mm (0.02-0.03in), 99.5% (metals basis); Copper turnings, 99.9% (metals basis); Copper rod, 2.0mm (0.08in) dia, 99.99% (metals basis); Copper plate, irregular, nominal 10x34x0.6cm (4x13.5x0.25in), Puratronic®, 99.999% (metals basis); Copper powder, spherical, -170+400 mesh, 99.9% (metals basis), Oxygen <1000ppm; Copper wire, 0.015mm (0.0006in) dia, 99.99% (metals basis); Copper sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis); Copper sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.995% (metals basis); Copper wire, 1.0mm (0.04in) dia, Puratronic®, 99.9999% (metals basis); Copper wire, 0.5mm (0.02in) dia, Puratronic®, 99.9999% (metals basis); Copper wire, 0.25mm (0.01in) dia, Puratronic®, 99.9999% (metals basis); Copper wire, 0.1mm (0.004in) dia, Puratronic®, 99.9999% (metals basis); Copper foil, 1.0mm (0.04in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.5mm (0.02in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.25mm (0.01in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.1mm (0.004in) thick, Puratronic®, 99.9999% (metals basis); Copper foil, 0.05mm (0.002in) thick, Puratronic®, 99.9999% (metals basis); Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, Puratronic®, 99.9999% (metals basis); Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, Puratronic®, 99.9999% (metals basis); Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, Puratronic®, 99.9999% (metals basis); Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, Puratronic®, 99.9999% (metals basis); Copper gauze, 20 mesh woven from 0.41mm (0.016in) dia wire; Copper powder, spherical, APS 10 micron, 99.9% (metals basis); Copper powder, spherical, -100+325 mesh, 99.9% (metals basis); Copper powder, -625 mesh, APS 3.25-4.75 micron, 99.9% (metals basis); Copper, Oil based standard solution, Specpure®, Cu 5000µg/g; Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, 99.995% (metals basis); Copper slug, 6.35mm (0.25in) dia x 12.7mm (0.50in) length, 99.996% (metals basis); Copper foil, 0.1mm (0.004in) thick, Puratronic®, 99.999% (metals basis); Copper Thinfoil, 0.015mm (0.0006in) thick, 99.97% (metals basis); Copper powder, -625 mesh, APS 0.50-1.5 micron, 99% (metals basis); Copper flake, 1-5 micron, 99.9% (metals basis); Copper gauze, 40 mesh woven from 0.056mm (0.0022in) dia wire; Copper sputtering target, 76.2mm (3.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis); Copper sputtering target, 76.2mm (3.0in) dia x 3.18mm (0.125in) thick, 99.999% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.999% (metals basis); Copper sputtering target, 50.8mm (2.0in) dia x 3.18mm (0.125in) thick, 99.999% (metals basis); Copper foil, 0.675mm (0.027in) thick, annealed, 99.9% (metals basis); Copper gauze, 50 mesh woven from 0.23mm (0.009in) dia wire; Copper powder, -100 mesh, 99.999% (metals basis); Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.996% (metals basis); Copper slug, 6.35mm (0.25in) dia x 6.35mm (0.25in) length, 99.99% (metals basis); Copper Thinfoil, 0.0125mm (0.0005in) thick, 99.9% (metals basis); Copper shot, 13mm (0.5in) dia, 99.99% (metals basis), oxygen free; Copper shot, 8mm (0.3in) & down, ACS, 99.9+% (metals basis); Copper wire, 1.0mm (0.04in) dia, Puratronic®, 99.999% (metals basis), Oxygen free; Copper wire, 0.5mm (0.02in) dia, Puratronic®, 99.999% (metals basis), Oxygen free; Copper foil, 0.25mm (0.01in) thick, annealed, 99.95% (metals basis), oxygen free; Copper foil, 0.5mm (0.02in) thick, Puratronic®, 99.998% (metals basis), Oxygen free; Copper foil, 0.05mm (0.002in) thick, annealed, 99.8% (metals basis); Copper Thinfoil, 0.01mm (0.0003in) thick, 99.8% (metals basis); Copper, Quant® Test Strips; Copper powder, -40+100 mesh, 99.5% (metals basis); Copper rod, 3.18mm (0.125in) dia, random lengths, Puratronic®, 99.999% (metals basis); Copper powder, -625 mesh, APS 2-3.50 micron, 99% (metals basis); Copper powder, -100 mesh, 99% (metals basis); Copper wire, 0.127mm (0.005in) dia, 99.999% (metals basis); Copper wire, 0.64mm (0.025in) dia, Puratronic®, 99.999% (metals basis), Oxygen free; Copper foil, 0.25mm (0.01in) thick, hard, Puratronic®, 99.999+% (metals basis); Copper foil, 0.127mm (0.005in) thick, annealed, 99.99+% (metals basis); Copper, plasma standard solution, Specpure®, Cu 10,000µg/ml; Copper, Oil based standard solution, Specpure®, Cu 1000µg/g; Copper rod, 6.35mm (0.25in) dia, 99.9% (metals basis); Copper powder, -325 mesh, 10% max +325 mesh, 99% (metals basis); Copper, plasma standard solution, Specpure®, Cu 1000µg/ml; Copper tubing, 1.59mm (0.0626in) OD, 0.876mm (0.0345in) ID, 99.9% (metals basis); Copper tubing, 3.175mm (0.125in) OD, 1.5mm (0.059in) ID, 99.9% (metals basis); Copper foil, 0.025mm (0.001in) thick, 99.8% (metals basis); Copper foil, 0.127mm (0.005in) thick, annealed, 99.9% (metals basis); Copper foil, 0.254mm (0.010in) thick, 99.9% (metals basis); Copper foil, 1.27mm (0.05in) thick, 99.9% (metals basis); Copper plate, 6.35mm (0.25in) thick, 99.9% (metals basis); Copper rod, 19mm (0.8in) dia, Puratronic®, 99.999% (metals basis); Copper rod, 5mm (0.2in) dia, Puratronic®, 99.999% (metals basis); Copper rod, 7mm (0.3in) dia, Puratronic®, 99.999% (metals basis); Copper foil, 0.25mm (0.01in) thick, Puratronic®, 99.9985% (metals basis); Copper foil, 0.5mm (0.02in) thick, Puratronic®, 99.9985% (metals basis); Copper foil, 1.0mm (0.04in) thick, Puratronic®, 99.999% (metals basis); Copper foil, 2.0mm (0.08in) thick, Puratronic®, 99.999% (metals basis); Copper powder, spherical, -100 mesh, 99.5% (metals basis); Copper wire, 2.0mm (0.08in) dia, Puratronic®, 99.999% (metals basis); Copper wire, 1.0mm (0.04in) dia, Puratronic®, 99.999% (metals basis); Copper wire, 0.5mm (0.02in) dia, Puratronic®, 99.999% (metals basis); Copper wire, 0.25mm (0.01in) dia, Puratronic®, 99.9985% (metals basis); Copper wire, 0.1mm (0.004in) dia, hard, Puratronic®, 99.9985% (metals basis); Copper wire, 0.025mm (0.001in) dia, Puratronic®, 99.995% (metals basis); Copper shot, 9mm (0.35in) & down, Puratronic®, 99.9999% (metals basis); Copper foil, 1.0mm (0.04in) thick, 99.99% (metals basis); Copper shot, 4-6mm (0.16-0.24in), Puratronic®, 99.999% (metals basis); Copper discs, 9.0+/-0.127mm (0.354+/-0.005in) dia x 0.8+/-0.051mm (0.03+/-0.002in) thick, 99.9995% (metals basis); Copper foil, 0.025mm (0.001in) thick, Puratronic®, 99.999% (metals basis); Copper wire, 0.5mm (0.02in) dia, annealed, 99.9% (metals basis); Copper wire, 1.0mm (0.04in) dia, annealed, 99.9% (metals basis); Copper powder, -22 mesh, Puratronic®, 99.999% (metals basis); Copper turnings, 99+% (metals basis); Copper powder, -150 mesh, 99.5% (metals basis); Copper shot, 1-10mm (0.04-0.4in), 99.9% (metals basis); Copper rod, 9.5mm (0.4in) dia, Puratronic®, 99.999% (metals basis); Finely divided black particulate dispersed in air. [Note: Exposure may occur in copper & brass plants and during the welding of copper alloys.]; reddish lustrous malleable metal
  • Melting point: 1083 °C
  • Boiling point: 2595 °C
  • Solubility: Insoluble
  • Safety sheet: Not available
  • Spectra: Check on SDBS. Add Spectra (Help).

From Wikipedia

Copper is a chemical element with the symbol Cu (from ) and atomic number 29. It is a ductile metal with very high thermal and electrical conductivity. Pure copper is soft and malleable; a freshly exposed surface has a reddish-orange color. It is used as a conductor of heat and electricity, a building material, and a constituent of various metal alloys.

The metal and its alloys have been used for thousands of years. In the Roman era, copper was principally mined on Cyprus, hence the origin of the name of the metal as сyprium (metal of Cyprus), later shortened to сuprum. Its compounds are commonly encountered as copper(II) salts, which often impart blue or green colors to minerals such as azurite and turquoise and have been widely used historically as pigments. Architectural structures built with copper corrode to give green verdigris (or patina). Decorative art prominently features copper, both by itself and as part of pigments.

Copper is essential to all living organisms as a trace dietary mineral because it is a key constituent of the respiratory enzyme complex cytochrome c oxidase. In molluscs and crustacea copper is a constituent of the blood pigment hemocyanin, which is replaced by the iron-complexed hemoglobin in fish and other vertebrates. The main areas where copper is found in humans are liver, muscle and bone. In sufficient concentration, copper compounds are poisonous to higher organisms and are used as bacteriostatic substances, fungicides, and wood preservatives.

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Other names

Copper (IUPAC Name)

References

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