File Name : s1 _stamp technical.tif

Caption : figure s1: technical illustration of the holder used to assemble the tem grid as mask and the piece of silicon for the photopatterning experiment. (a) assembled holder, (b) the round cavity next to the aperture is used for the tem grid and the silicon is placed in the rectangular recession above the small holes in the bottom of the holder allowing the polymer solution to completely cover the ots-itxsp functionalized silicon. the holder is made of polyether ether ketone with a total size of 45 mm and a thickness of 10 mm (upper part) / 16.42 mm (lower part). the recession for the silicon is 9.2 mm x 9.2 mm and the hole for the tem grid 3.1 mm with a height of 0.3 mm (b). the little rod has a thread that allows to lock into the lower part and keep both the tem grid and the silicon in place.